Uyemura 'USC-200' Electroless Copper Plating (ELP)

Deposition of thin layer of copper on the whole panel, including the laser-drilled holes, by catalytic chemical reaction (no external electricity needed - electroless), that will be used as based conductor for the succeeding electrolytic copper plating.

Process Name : Electroless Copper Plating

Module Name & Function:
• Cleaning: Removes the slight oxide of holes and contamination on the substrate and holes. Improve Pd adsorption.
• Soft Etching: Roughens the surface of Cu substrate, Remove the oxide on the surface of Cu substrate.
• Acid-dip: The acid-dip rinse serves as buffer solution between etching cleaner and activator and as protection against carry over.
• Predip: It is used to ensure an optimum and uniform amount Activator MAT-SP on the substrate.Improves wetting of the material.
• Activator: Absorb Pd2+ on ABF substrate and as catalytic agent for E’less copper between ABF substrate.
• Reducer: Converts palladium ions (Pd2+) to metallic palladium (Pd0) especially on the non-copper surfaces.
• Accelerator: It is used to activate the Pd layer created in the reducer bath.
• Electroless Copper: Deposits a low internal stress Cu layer.

Status: Installed

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For more specification details, please click below downloadable document.